Xilinx Inc. XC7Z045-2FFG900I
Xilinx Inc. XC7Z045-2FFG900I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
900-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
900
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
800MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z045
JESD-30 Code
S-PBGA-B900
Operating Supply Voltage
1V
Supply Voltage-Max (Vsup)
1.05V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Memory Type
ROMless
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-2
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
3.35mm
Length
31mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.Manufacturer assigns package 900-BBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq?-7000 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.A 1V power supply should be used.There is no safe voltage for the SoCs wireless above 1.05V.Having 900 terminations in total makes system on a chip possible.By searching XC7Z045, you will find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 800MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900I System On Chip (SoC) applications.
- Optical drive
- High-end PLC
- POS Terminals
- Smartphone accessories
- CNC control
- System-on-chip (SoC)
- Digital Media
- Temperature
- AC drive control module
- Automated sorting equipment
- ImagePart NumberManufacturerPackage / CaseData Bus WidthInterfaceMemory TypeSupply VoltagePeripheralsTechnologyJESD-609 CodeView Compare
XC7Z045-2FFG900I
Xilinx Inc.900-BBGA, FCBGA
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
ROMless
1 V
DMA
CMOS
e1
XC7Z030-2FFG676IXilinx Inc.676-BBGA, FCBGA
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
-
1 V
DMA
CMOS
e1
XC7Z045-2FFG900I
VS
XC7Z030-2FFG676I
MCIMX6D7CVT08ACNXP USA Inc.624-FBGA, FCBGA
-
-
-
-
-
CMOS
e1
XC7Z045-2FFG900I
VS
MCIMX6D7CVT08AC
XC7Z030-2FBG484IXilinx Inc.484-BBGA, FCBGA
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
-
1 V
DMA
CMOS
e1
XC7Z045-2FFG900I
VS
XC7Z030-2FBG484I
- XC7Z030-2FBG484EXilinx Inc.
484-BBGA, FCBGA
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
-
1 V
DMA
CMOS
e1
XC7Z045-2FFG900I
VS
XC7Z030-2FBG484E
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
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