Xilinx Inc. XC7Z045-1FFG676I
Xilinx Inc. XC7Z045-1FFG676I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
676-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Subcategory
Other uPs/uCs/Peripheral ICs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
667MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z045
Pin Count
676
JESD-30 Code
S-PBGA-B676
Operating Supply Voltage
1V
Supply Voltage-Max (Vsup)
1.05V
Power Supplies
11.8V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Memory Type
ROMless
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-1
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable
N
Height Seated (Max)
3.37mm
Length
27mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design is based on the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V rating is recommended.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.In total, there are 676 terminations, which makes system on a chip possible.There is no doubt that this system on a chip is outstanding, just as other high-quality Other uPs/uCs/Peripheral ICs will do.System on chip requires 11.8V power supplies.By searching XC7Z045, you can find system on chips with similar specs and purposes.A frequency of 667MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FFG676I System On Chip (SoC) applications.
- Smart appliances
- Microcontroller based SoC ( RISC-V, ARM)
- Smartphones
- Microprocessors
- RISC-V
- Robotics
- Measurement testers
- Print Special Issue Flyer
- Temperature Sensors
- Efficient hardware for inference of neural networks
- ImagePart NumberManufacturerPackage / CaseData Bus WidthInterfacePeripheralsRoHS StatusPackagingPart StatusOperating Supply VoltageView Compare
XC7Z045-1FFG676I
Xilinx Inc.676-BBGA, FCBGA
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
DMA
ROHS3 Compliant
Tray
Active
1 V
- XC7Z030-1FBG676CXilinx Inc.
676-BBGA, FCBGA
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
DMA
ROHS3 Compliant
Tray
Active
1 V
XC7Z045-1FFG676I
VS
XC7Z030-1FBG676C
- XC7Z030-1FFG676CXilinx Inc.
676-BBGA, FCBGA
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
DMA
ROHS3 Compliant
Tray
Active
1 V
XC7Z045-1FFG676I
VS
XC7Z030-1FFG676C
XC7Z030-1FBG484CXilinx Inc.484-BBGA, FCBGA
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
DMA
ROHS3 Compliant
Tray
Active
1 V
XC7Z045-1FFG676I
VS
XC7Z030-1FBG484C
MPC8544CVJALFANXP USA Inc.783-BBGA, FCBGA
-
-
-
ROHS3 Compliant
Tray
Active
-
XC7Z045-1FFG676I
VS
MPC8544CVJALFA
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
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