Xilinx Inc. XC7Z020-2CLG400I
Xilinx Inc. XC7Z020-2CLG400I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
400-LFBGA, CSPBGA
Surface Mount
YES
Number of Pins
400
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
400
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1V
Terminal Pitch
0.8mm
Frequency
766MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z020
Operating Supply Voltage
1V
Supply Voltage-Max (Vsup)
1.05V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-2
RAM (words)
256000
Primary Attributes
Artix™-7 FPGA, 85K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
1.6mm
Length
17mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.The manufacturer assigns this system on a chip with a 400-LFBGA, CSPBGA package as per the manufacturer's specifications.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the Zynq?-7000 series.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Artix?-7 FPGA, 85K Logic Cells and that is something to note.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.It is advised to utilize a 1V power supply.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.Having 400 terminations in total makes system on a chip possible.You can get system on chips with similar specs and purposes by searching XC7Z020.wireless SoCs operate at 766MHz.In this SoC meaning, ARM serves as the core architecture.The computer SoC is available in 400-pin form.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z020-2CLG400I System On Chip (SoC) applications.
- Flow Sensors
- Published Paper
- POS Terminals
- Three phase UPS
- Keyboard
- ARM
- Test and Measurement
- AC drive control module
- Deep learning hardware
- Digital Signal Processing
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of I/ORAM SizePeripheralsTerminal PositionPackagingTerminal PitchView Compare
XC7Z020-2CLG400I
Xilinx Inc.400-LFBGA, CSPBGA
400
130
256KB
DMA
BOTTOM
Tray
0.8 mm
- XC7Z010-1CLG400IXilinx Inc.
400-LFBGA, CSPBGA
400
130
256KB
DMA
BOTTOM
Tray
0.8 mm
XC7Z020-2CLG400I
VS
XC7Z010-1CLG400I
- XC7Z010-1CLG400CXilinx Inc.
400-LFBGA, CSPBGA
400
130
256KB
DMA
BOTTOM
Tray
0.8 mm
XC7Z020-2CLG400I
VS
XC7Z010-1CLG400C
- XC7Z020-1CLG400CXilinx Inc.
400-LFBGA, CSPBGA
400
130
256KB
DMA
BOTTOM
Tray
0.8 mm
XC7Z020-2CLG400I
VS
XC7Z020-1CLG400C
M2GL005-VFG400Microsemi Corporation400-LFBGA
400
169
87.9 kB
-
BOTTOM
Tray
0.8 mm
XC7Z020-2CLG400I
VS
M2GL005-VFG400
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
