Texas Instruments CSD87351ZQ5D
CSD87351ZQ5D
In Stock:94131
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Texas Instruments CSD87351ZQ5D information
Type
Parameter
Factory Lead Time
16 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-PowerLDFN
Number of Pins
8
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Series
NexFET™
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Max Power Dissipation
12W
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
260
Reach Compliance Code
not_compliant
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
CSD87351
FET Type
2 N-Channel (Dual) Asymmetrical
Vgs(th) (Max) @ Id
2.1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
1255pF @ 15V
Gate Charge (Qg) (Max) @ Vgs
7.7nC @ 4.5V
Rise Time
10ns
Drain to Source Voltage (Vdss)
30V
Fall Time (Typ)
4.2 ns
Continuous Drain Current (ID)
32A
Interface IC Type
HALF BRIDGE BASED MOSFET DRIVER
FET Feature
Logic Level Gate
Height
1.5mm
Length
5mm
Width
6mm
Thickness
1.5mm
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
CSD87351ZQ5D Description
The CSD87351ZQ5D NexFET powered power module is optimized for synchronous buck applications, providing high current, high efficiency and high frequency capability in a small form factor of 5 mm ?á 6 mm. Optimized for 5V gate driver applications, the product provides a flexible solution that provides high-density power when used in conjunction with any 5V gate driver of an external controller / driver.
CSD87351ZQ5D Features
1? Half-Bridge Power Block
? 90% System Efficiency at 20 A
? Up to 32-A Operation
? High-Frequency Operation (up to 1.5 MHz)
? High-Density SON 5-mm ?á 6-mm Footprint
? Optimized for 5-V Gate Drive
? Low-Switching Losses
? Ultra-Low-Inductance Package
? RoHS Compliant
? Halogen Free
? Lead-Free Terminal Plating
? Improved ESD Protection
CSD87351ZQ5D Applications
? Synchronous Buck Converters
¨C High-Frequency Applications
¨C High-Current, Low-Duty Cycle Applications
? Multiphase Synchronous Buck Converters
? POL DC-DC Converters
? IMVP, VRM, and VRD Applications
- ImagePart NumberManufacturerPackage / CaseNumber of PinsRoHS StatusMountMounting TypePart StatusPackagingJESD-609 CodeView Compare
CSD87351ZQ5D
NA8-PowerLDFN
8
ROHS3 Compliant
Surface Mount
Surface Mount
Active
Tape & Reel (TR)
e3
IPD090N03LGATMA1Infineon TechnologiesTO-252-3, DPak (2 Leads + Tab), SC-63
3
ROHS3 Compliant
Surface Mount
Surface Mount
Active
Tape & Reel (TR)
e3
CSD87351ZQ5D
VS
IPD090N03LGATMA1
FDD8878ON SemiconductorTO-252-3, DPak (2 Leads + Tab), SC-63
3
ROHS3 Compliant
Surface Mount
Surface Mount
Active
Tape & Reel (TR)
e3
CSD87351ZQ5D
VS
FDD8878
BSZ100N03MSGATMA1Infineon Technologies8-PowerTDFN
8
ROHS3 Compliant
Surface Mount
Surface Mount
Active
Tape & Reel (TR)
e3
CSD87351ZQ5D
VS
BSZ100N03MSGATMA1
IRFH9310TRPBFInfineon Technologies8-PowerVDFN
8
ROHS3 Compliant
Surface Mount
Surface Mount
Active
Tape & Reel (TR)
e3
CSD87351ZQ5D
VS
IRFH9310TRPBF
Aztec Electronics's Payment Terms
Aztec Electronics offers many types of payment options, and support in multiple currencies such as GBP, US dollars, RMB, etc. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s CSD87351ZQ5D price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
