Texas Instruments CSD87312Q3E
CSD87312Q3E
Texas Instruments CSD87312Q3E information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-PowerTDFN
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Cut Tape (CT)
Series
NexFET™
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
7
ECCN Code
EAR99
Additional Feature
AVALANCHE RATED, ULTRA-LOW RESISTANCE
Subcategory
FET General Purpose Powers
Max Power Dissipation
2.5W
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
260
Reach Compliance Code
not_compliant
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
CSD87312
Number of Elements
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2.5W
Turn On Delay Time
7.8 ns
FET Type
2 N-Channel (Dual) Common Source
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
33m Ω @ 7A , 8V
Vgs(th) (Max) @ Id
1.3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
1250pF @ 15V
Gate Charge (Qg) (Max) @ Vgs
8.2nC @ 4.5V
Rise Time
16ns
Drain to Source Voltage (Vdss)
30V
Fall Time (Typ)
2.8 ns
Turn-Off Delay Time
17 ns
Continuous Drain Current (ID)
27A
Gate to Source Voltage (Vgs)
10V
Drain to Source Breakdown Voltage
30V
Pulsed Drain Current-Max (IDM)
45A
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
Feedback Cap-Max (Crss)
16 pF
Length
3.3mm
Width
3.3mm
Thickness
900μm
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
- PCN Design/Specification :
- PCN Packaging :
CSD87312Q3E Description
A dual N-channel, 30V common-source device designed for adaptor/USB input protection is the CSD87312Q3E. For multi-cell battery charging applications where space is limited, this SON 3.3 x 3.3mm device provides low drain to drain on-resistanee that reduces losses and delivers low comp orient count.
CSD87312Q3E Features
? Connectivity via a Common Source
? Extremely Low Drain to Drain-On Resistance
? SON 3.3 x 3.3mm Plastic Package for Saving Space
? Perfect for a 5V gate drive
? High Thermal Conductivity
? Rated for Avalanches
? Plating for Pb-free terminals
? RoHS conformant
? Free of Halogen
CSD87312Q3E Applications
Adaptor
USB input security for tablets and laptops
- ImagePart NumberManufacturerPackage / CaseNumber of PinsRoHS StatusMoisture Sensitivity Level (MSL)Mounting TypeECCN CodeOperating TemperatureMountView Compare
CSD87312Q3E
NA8-PowerTDFN
8
ROHS3 Compliant
1 (Unlimited)
Surface Mount
EAR99
-55°C ~ 150°C (TJ)
Surface Mount
IRFR3303TRPBFInfineon TechnologiesTO-252-3, DPak (2 Leads + Tab), SC-63
3
ROHS3 Compliant
1 (Unlimited)
Surface Mount
EAR99
-55°C ~ 150°C (TJ)
Surface Mount
CSD87312Q3E
VS
IRFR3303TRPBF
FDMS3660SON Semiconductor8-PowerTDFN
8
ROHS3 Compliant
1 (Unlimited)
Surface Mount
EAR99
-55°C ~ 150°C (TJ)
Surface Mount
CSD87312Q3E
VS
FDMS3660S
- FDMS3622SON Semiconductor
8-PowerTDFN
8
ROHS3 Compliant
1 (Unlimited)
Surface Mount
EAR99
-55°C ~ 150°C (TJ)
Surface Mount
CSD87312Q3E
VS
FDMS3622S
BSC0923NDIATMA1Infineon Technologies8-PowerTDFN
8
ROHS3 Compliant
1 (Unlimited)
Surface Mount
EAR99
-55°C ~ 150°C (TJ)
Surface Mount
CSD87312Q3E
VS
BSC0923NDIATMA1
Aztec Electronics's Payment Terms
Aztec Electronics offers many types of payment options, and support in multiple currencies such as GBP, US dollars, RMB, etc. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s CSD87312Q3E price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
