Infineon Technologies IRF7303TRPBF
IRF7303TRPBF
In Stock:94131
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Infineon Technologies IRF7303TRPBF information
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
1997
Series
HEXFET®
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Resistance
50mOhm
Terminal Finish
Matte Tin (Sn)
Additional Feature
ULTRA LOW RESISTANCE
Voltage - Rated DC
30V
Max Power Dissipation
2W
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Current Rating
4.9A
Reflow Temperature-Max (s)
30
Base Part Number
IRF7303PBF
Number of Elements
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2W
Turn On Delay Time
6.8 ns
FET Type
2 N-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
50m Ω @ 2.4A, 10V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
520pF @ 25V
Gate Charge (Qg) (Max) @ Vgs
25nC @ 10V
Rise Time
21ns
Fall Time (Typ)
7.7 ns
Turn-Off Delay Time
22 ns
Continuous Drain Current (ID)
4.9A
Threshold Voltage
1V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
30V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Recovery Time
71 ns
FET Feature
Standard
Nominal Vgs
1 V
Height
1.4986mm
Length
4.9784mm
Width
3.9878mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Other Related Documents :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
IRF7303TRPBF Description
The Fifth Generation HEXFETs from International Rectifier use cutting-edge processing techniques to create incredibly low on-resistance per silicon area. With the quick switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, the designer now has a highly effective and dependable device for use in a variety of applications. The new Micro8 package, with a footprint area that is half that of the conventional SO-8, delivers the smallest footprint of any SOIC design. The Micro8 is the ideal tool since in many applications printed circuit board space is at a premium. Thanks to its low profile, the Micro8 will easily fit into extremely small application contexts like portable devices and PCMCIA cards (1.1mm).
IRF7303TRPBF Features
? Technology of the Generation
? Extremely Low On Resistance
? Double-N-Channel MOSFET
? Very Tiny SOIC Package
? Low Profile (around 1.1mm)
? Sold on reel-to-reel tape
? Rapid Switching
? Lead-Free
IRF7303TRPBF Applications
Switching applications
- ImagePart NumberManufacturerMountPackage / CaseContinuous Drain Current (ID)Threshold VoltageGate to Source Voltage (Vgs)Max Power DissipationPower DissipationNumber of TerminationsView Compare
IRF7303TRPBF
Infineon TechnologiesSurface Mount
8-SOIC (0.154, 3.90mm Width)
4.9 A
1 V
20 V
2 W
2 W
8
ZXMC3A17DN8TADiodes IncorporatedSurface Mount
8-SOIC (0.154, 3.90mm Width)
5.4 A
1 V
20 V
2.1 W
2.1 W
8
IRF7303TRPBF
VS
ZXMC3A17DN8TA
SI4532CDY-T1-GE3Vishay SiliconixSurface Mount
8-SOIC (0.154, 3.90mm Width)
6 A
1 V
20 V
2.78 W
2.78 W
8
IRF7303TRPBF
VS
SI4532CDY-T1-GE3
FDS6930BON SemiconductorSurface Mount
8-SOIC (0.154, 3.90mm Width)
5.5 A
1.9 V
20 V
2 W
2 W
8
IRF7303TRPBF
VS
FDS6930B
Aztec Electronics's Payment Terms
Aztec Electronics offers many types of payment options, and support in multiple currencies such as GBP, US dollars, RMB, etc. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Infineon Technologies's IRF7303TRPBF price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
