Texas Instruments SN74LVC2G74DCTR
SN74LVC2G74DCTR
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Texas Instruments SN74LVC2G74DCTR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 4 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-LSSOP, 8-MSOP (0.110, 2.80mm Width)
Number of Pins
8
Weight
23.388357mg
Operating Temperature
-40°C~125°C TA
Packaging
Cut Tape (CT)
Series
74LVC
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
Termination
SMD/SMT
ECCN Code
EAR99
Type
D-Type
Subcategory
FF/Latches
Packing Method
TR
Technology
CMOS
Voltage - Supply
1.65V~5.5V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.8V
Terminal Pitch
0.65mm
Base Part Number
74LVC2G74
Function
Set(Preset) and Reset
Output Type
Differential
Polarity
Non-Inverting
Supply Voltage-Max (Vsup)
5.5V
Power Supplies
3.3V
Number of Channels
1
Output Current
32mA
Number of Bits
1
Clock Frequency
200MHz
Propagation Delay
6.2 ns
Quiescent Current
10μA
Turn On Delay Time
4.1 ns
Family
LVC/LCX/Z
Logic Function
AND, D-Type
Output Characteristics
3-STATE
Current - Output High, Low
32mA 32mA
Number of Gates
2
Max Propagation Delay @ V, Max CL
4.4ns @ 5V, 50pF
Prop.
5.9 ns
Trigger Type
Positive Edge
Input Capacitance
5pF
Clock Edge Trigger Type
Positive Edge
Height
1.3mm
Length
2.95mm
Width
2.8mm
Thickness
1.29mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
SN74LVC2G74DCTR Overview
The item is packaged in 8-LSSOP, 8-MSOP (0.110, 2.80mm Width)cases. Package Cut Tape (CT)embeds it. As configured, the output uses Differential. The trigger it is configured with uses Positive Edge. Surface Mountis occupied by this electronic component. A 1.65V~5.5Vsupply voltage is required for it to operate. It is at -40°C~125°C TAdegrees Celsius that the system is operating. The type of this D latch is D-Type. JK flip flop is a part of the 74LVCseries of FPGAs. Its output frequency should not exceed 200MHz. Currently, there are 8 terminations. You can search similar parts based on 74LVC2G74. It is powered by a voltage of 1.8V . The input capacitance of this T flip flop is 5pF farads, which is defined as the capacitance between the input terminals of an op amp with either input grounded. This D flip flop belongs to the family of LVC/LCX/Z. A part of the electronic system is mounted in the way of Surface Mount. The 8pins are designed into the board. In this device, the clock edge trigger type is Positive Edge. The RS flip flops belongs to FF/Latches base part number. It is designed with 1bits. The maximal supply voltage (Vsup) reaches 5.5V. This D flip flop is well suited for TR based on its reliable performance. It operates from 3.3V power supplies. With a current output of 32mA , it offers maximum design flexibility. 10μAquiescent current consumed. Currently, there are 1 channels available. In its basic form, it contains 2 gates.
SN74LVC2G74DCTR Features
Cut Tape (CT) package
74LVC series
8 pins
1 Bits
3.3V power supplies
2 gates
SN74LVC2G74DCTR Applications
There are a lot of Texas Instruments SN74LVC2G74DCTR Flip Flops applications.
- Instrumentation
- Data transfer
- Load Control
- Computing
- Balanced Propagation Delays
- Individual Asynchronous Resets
- Patented noise
- Frequency Dividers
- High Performance Logic for test systems
- Consumer
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionPropagation DelayClock Edge Trigger TypeSupply VoltageQuiescent CurrentRadiation HardeningView Compare
SN74LVC2G74DCTR
NA8-LSSOP, 8-MSOP (0.110, 2.80mm Width)
8
AND, D-Type
6.2 ns
Positive Edge
1.8 V
10 μA
No
SN74AUC1G74DCTRNA8-LSSOP, 8-MSOP (0.110, 2.80mm Width)
8
AND, D-Type
4.5 ns
Positive Edge
1.2 V
-
No
SN74LVC2G74DCTR
VS
SN74AUC1G74DCTR
SN74LVC1G74DCTRNA8-LSSOP, 8-MSOP (0.110, 2.80mm Width)
8
AND, D-Type, Flip-Flop
6.4 ns
Positive Edge
3.3 V
10 μA
No
SN74LVC2G74DCTR
VS
SN74LVC1G74DCTR
TC7W74FKTE85LFToshibaSSOP
8
AND, D-Type
26 ns
Positive Edge
-
2 μA
No
SN74LVC2G74DCTR
VS
TC7W74FKTE85LF
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We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s SN74LVC2G74DCTR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
