Texas Instruments SN74HC574DWR
SN74HC574DWR
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Texas Instruments SN74HC574DWR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 6 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
20-SOIC (0.295, 7.50mm Width)
Number of Pins
20
Weight
500.709277mg
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Series
74HC
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
20
ECCN Code
EAR99
Type
D-Type
Terminal Finish
Matte Tin (Sn)
Subcategory
FF/Latches
Packing Method
TR
Technology
CMOS
Voltage - Supply
2V~6V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
5V
Base Part Number
74HC574
Function
Standard
Output Type
Tri-State, Non-Inverted
Operating Supply Voltage
5V
Number of Elements
1
Polarity
Non-Inverting
Supply Voltage-Max (Vsup)
6V
Power Supplies
2/6V
Supply Voltage-Min (Vsup)
2V
Number of Circuits
8
Load Capacitance
50pF
Number of Ports
2
Output Current
7.8mA
Number of Bits
8
Clock Frequency
36MHz
Propagation Delay
265 ns
Quiescent Current
8μA
Turn On Delay Time
24 ns
Family
HC/UH
Logic Function
D-Type, Flip-Flop
Current - Output High, Low
7.8mA 7.8mA
Max Propagation Delay @ V, Max CL
46ns @ 6V, 150pF
Prop.
0.066 ns
Trigger Type
Positive Edge
Input Capacitance
3pF
Number of Input Lines
3
Count Direction
UNIDIRECTIONAL
Clock Edge Trigger Type
Positive Edge
Max
24000000Hz
Height
2.65mm
Length
12.8mm
Width
7.5mm
Thickness
2.35mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- Datasheets :
SN74HC574DWR Overview
20-SOIC (0.295, 7.50mm Width)is the way it is packaged. The package Tape & Reel (TR)contains it. In the configuration, Tri-State, Non-Invertedis used as the output. It is configured with a trigger that uses Positive Edge. Surface Mountmounts this electrical part. A voltage of 2V~6Vis required for its operation. In the operating environment, the temperature is -40°C~85°C TA. The type of this D latch is D-Type. JK flip flop belongs to the 74HCseries of FPGAs. Its output frequency should not exceed 36MHz Hz. D latch consists of 1 elements. It has been determined that there have been 20 terminations. JK flip flop belongs to 74HC574 family. Power is provided by a 5V supply. The input capacitance of this T flip flop is 3pF farads, which is defined as the capacitance between the input terminals of an op amp with either input grounded. Electronic devices of this type belong to the HC/UHfamily. Electronic part Surface Mountis mounted in the way. A total of 20pins are provided on this board. In this device, the clock edge trigger type is Positive Edge. This device has the base part number FF/Latches. An electronic part designed with 8bits is used in this application. 6Vis the maximum supply voltage (Vsup). For normal operation, the supply voltage (Vsup) should be above 2V. The superior flexibility of this circuit is achieved by using 8 circuits. A reliable performance of this D flip flop makes it well suited for use in TR. There are 2/6V power supplies attached to it. The D flip flop has no ports embedded. For high efficiency, the supply voltage should be kept at 5V. With an output current of 7.8mA, it is possible to design the device in any way you want. It is reported that there are 3 input lines. 8μAquiescent current consumed.
SN74HC574DWR Features
Tape & Reel (TR) package
74HC series
20 pins
8 Bits
2/6V power supplies
SN74HC574DWR Applications
There are a lot of Texas Instruments SN74HC574DWR Flip Flops applications.
- Computers
- Circuit Design
- Latch-up performance
- CMOS Process
- Buffered Clock
- Data storage
- Asynchronous counter
- Event Detectors
- Balanced Propagation Delays
- Dynamic threshold performance
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionNumber of ElementsPropagation DelayClock Edge Trigger TypeSupply VoltageQuiescent CurrentView Compare
SN74HC574DWR
NA20-SOIC (0.295, 7.50mm Width)
20
D-Type, Flip-Flop
1
265 ns
Positive Edge
5 V
8 μA
- SN74HC374DWRNA
20-SOIC (0.295, 7.50mm Width)
20
D-Type, Flip-Flop
1
230 ns
Positive Edge
5 V
8 μA
SN74HC574DWR
VS
SN74HC374DWR
MC74HC574ADWGON Semiconductor20-SOIC (0.295, 7.50mm Width)
20
D-Type, Flip-Flop
1
240 ns
Positive Edge
3 V
-
SN74HC574DWR
VS
MC74HC574ADWG
- CD74HC374M96NA
20-SOIC (0.295, 7.50mm Width)
20
D-Type, Flip-Flop
1
250 ns
Positive Edge
4.5 V
8 μA
SN74HC574DWR
VS
CD74HC374M96
- CD74HC574MNA
20-SOIC (0.295, 7.50mm Width)
20
D-Type, Flip-Flop
1
250 ns
Positive Edge
4.5 V
8 μA
SN74HC574DWR
VS
CD74HC574M
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We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
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2.Are the Texas Instruments Incorporated (TI)'s SN74HC574DWR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
