Cypress Semiconductor Corp CY2309ZXC-1H
CY2309ZXC-1H
In Stock:94131
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Unit Price
Ext Price
1
$18.900000
$18.900000
10
$17.826000
$178.260000
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Cypress Semiconductor Corp CY2309ZXC-1H information
Type
Parameter
Factory Lead Time
6 Weeks
Contact Plating
Gold, Tin
Mounting Type
Surface Mount
Package / Case
16-TSSOP (0.173, 4.40mm Width)
Surface Mount
YES
Number of Pins
16
Operating Temperature
0°C~70°C
Packaging
Tube
Published
2002
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
16
Type
Fanout Buffer (Distribution), Zero Delay Buffer
Terminal Finish
Matte Tin (Sn)
Subcategory
Clock Drivers
Voltage - Supply
3V~3.6V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
0.65mm
Frequency
133.33MHz
Reflow Temperature-Max (s)
30
Base Part Number
CY2309
Output
LVCMOS
Pin Count
16
Number of Outputs
9
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Number of Circuits
1
Nominal Supply Current
32mA
Input
LVCMOS, LVTTL
Ratio - Input:Output
1:9
Max I(ol)
0.008 A
PLL
Yes with Bypass
Differential - Input:Output
No/No
Propagation Delay (tpd)
8.7 ns
Same Edge Skew-Max (tskwd)
0.25 ns
Length
5mm
Width
4.4mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
cypresssemiconductorcorp-cy467269103pod-environmentalinformation-2998.pdf
- PCN Obsolescence/ EOL :
cypresssemiconductorcorp-cy8c5888axqlp096-pcnobsolescenceeol-1262.pdf
- PCN Assembly/Origin :
- PCN Packaging :
cypresssemiconductorcorp-cy467269103-pcnpackaging-5650.pdf
cypresssemiconductorcorp-cy467269103pod-pcnpackaging-3002.pdf
- MaterialsSheet :
CY2309ZXC-1H Overview
This clock IC is packaged using the Tube method. In the 16-TSSOP (0.173, 4.40mm Width) package, there is an embedded clock generator. In the reflowing process, this clock generator ic is able to maintain a maximum temperature of 260. 16 terminations can be found in frequency synthesizer. This time clock generator should be voltaged at 3.3V. This clock generator receives its inputs from LVCMOS, LVTTL, which is designed to be the clock source. 1 circuits are used to achieve clock PLL's superior flexibility. Surface Mount-slots make it easy to mount this electronic component on panels. It would be possible to supply this clock PLL with 3.6V of power. Safety considerations dictate that the supply voltage for this frequency synthesizer should be greater than 3V. This clock PLL works with a supply voltage of 3V~3.6V. Test statistics suggest setting the ambient temperature at 0°C~70°C, which is 0°C~70°C. There are several logic levels in LVCMOS logic that can be used with this clock generator. Fanout Buffer (Distribution), Zero Delay Buffer is the type of electrical part that this component is classified as. In this IC, a 16-bit frequency generator is designed specifically for use in microprocessors. CY2309 is the base part number for finding related electronic parts. It is possible to connect to the PLL via 16 pins. RF synthesizers can handle a voltage of 3.3V as the supply voltage. This clock generator can be classified as a kind of Clock Drivers in general. 9 signal outputs allow for maximi9ation of output frequency. This clock generator offers low timing skew at 0.25 ns Max. By operating at a frequency of 133.33MHz, frequency generator is able to achieve high efficiency.
CY2309ZXC-1H Features
Available in the 16-TSSOP (0.173, 4.40mm Width)
Supply voltage of 3.3V
Operating supply voltage of 3.3V
CY2309ZXC-1H Applications
There are a lot of Cypress Semiconductor Corp CY2309ZXC-1H Clock Generators applications.
- Automatic test equipment
- Main oscillator in receiver
- Camera systems
- Telecommunication systems
- Digital circuits
- Radiotelephones
- Jitter reduction
- Phase modulation cellular systems
- Set-top boxes
- Vector network analyzers (VNA)
- ImagePart NumberManufacturerPackage / CaseNumber of PinsInputNumber of OutputsSupply VoltageOperating Supply VoltagePin CountView Compare
CY2309ZXC-1H
Cypress Semiconductor Corp16-TSSOP (0.173, 4.40mm Width)
16
LVCMOS, LVTTL
9
3.3 V
3.3 V
16
- CY23S09ZXC-1HCypress Semiconductor Corp
16-TSSOP (0.173, 4.40mm Width)
16
LVCMOS, LVTTL
9
3.3 V
3.3 V
16
CY2309ZXC-1H
VS
CY23S09ZXC-1H
- CY2309ZXI-1HCypress Semiconductor Corp
16-TSSOP (0.173, 4.40mm Width)
16
LVCMOS, LVTTL
9
3.3 V
3.3 V
16
CY2309ZXC-1H
VS
CY2309ZXI-1H
- 2309-1HPGGIntegrated Device Technology (IDT)
TSSOP
16
LVTTL
9
3.3 V
3.3 V
16
CY2309ZXC-1H
VS
2309-1HPGG
- CY2309ZXI-1HTCypress Semiconductor Corp
16-TSSOP (0.173, 4.40mm Width)
16
LVCMOS, LVTTL
9
3.3 V
3.3 V
16
CY2309ZXC-1H
VS
CY2309ZXI-1HT
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2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
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2.Are the Cypress Semiconductor's CY2309ZXC-1H price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.