Xilinx Inc. XC6SLX16-2FTG256C
Xilinx Inc. XC6SLX16-2FTG256C information
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2008
Series
Spartan®-6 LX
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.2V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Base Part Number
XC6SLX16
Pin Count
256
Number of Outputs
186
Operating Supply Voltage
1.2V
Number of I/O
186
RAM Size
72kB
Clock Frequency
667MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
14579
Total RAM Bits
589824
Number of LABs/CLBs
1139
Speed Grade
2
Number of Registers
18224
Height Seated (Max)
1.55mm
Length
17mm
Width
17mm
Radiation Hardening
No
REACH SVHC
Unknown
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
XC6SLX16-2FTG256C Overview
As part of the 256-LBGA package, it is included. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. Fpga chips is programmed wFpga chipsh 186 I/Os for transferring data in a more coherent manner. A fundamental building block contains 14579 logic elements or cells. 1.2V volts power it. There is a Field Programmable Gate Arrays family component in this FPGA part. This FPGA module can be attached to the development board with a Surface Mount. This device is powered by a 1.14V~1.26V battery. The FPGA belongs to the Spartan?-6 LX series of FPGAs, and it is one type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A total of 186 outputs are incorporated into this device. A model of this FPGA is contained in Tray for the purpose of saving space. In total, it has a total of 256 terminations. Having a RAM bit size of 589824 means that this device will offer you a lot of memory. In order to find related parts, you can use its base part number XC6SLX16. Fpga electronics is important that this FPGA module has a RAM si72kBe of 72kB in order to ensure that the program will run normally. There are 256 pins on this device. 1139 LABs/CLBs are integrated into this FPGA. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. The 1.2V supply voltage provides designers with full flexibility in their designs. The device has a total of 256 pins on fpga semiconductor. Fpga semiconductor typically uses a crystal oscillating at 667MHz. In order to store and transfer data, a total of 18224 registers are used.
XC6SLX16-2FTG256C Features
186 I/Os
Up to 589824 RAM bits
256 LABs/CLBs
18224 registers
XC6SLX16-2FTG256C Applications
There are a lot of Xilinx Inc. XC6SLX16-2FTG256C FPGAs applications.
- Defense Applications
- Bioinformatics
- Data Mining
- Automation
- Scientific Instruments
- Voice recognition
- ASIC prototyping
- Wired Communications
- Development Boards and Shields for Microcontrollers
- Data center search engines
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltageRoHS StatusMountView Compare
XC6SLX16-2FTG256C
Xilinx Inc.256-LBGA
256
14579
186
72 kB
1.2 V
ROHS3 Compliant
Surface Mount
XC3S500E-4FGG320CXilinx Inc.320-BGA
320
10476
232
45 kB
1.2 V
ROHS3 Compliant
Surface Mount
XC6SLX16-2FTG256C
VS
XC3S500E-4FGG320C
- XC3S700A-4FTG256CXilinx Inc.
256-LBGA
256
13248
161
45 kB
1.2 V
ROHS3 Compliant
Surface Mount
XC6SLX16-2FTG256C
VS
XC3S700A-4FTG256C
XC7A15T-1CSG325CXilinx Inc.324-LFBGA, CSPBGA
325
16640
150
112.5 kB
1 V
ROHS3 Compliant
Surface Mount
XC6SLX16-2FTG256C
VS
XC7A15T-1CSG325C
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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