Texas Instruments TMS320VC33PGE120
TMS320VC33PGE120
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Texas Instruments TMS320VC33PGE120 information
Type
Parameter
Lifecycle Status
ACTIVE (Last Updated: 1 day ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
144-LQFP
Number of Pins
144
Weight
1.290414g
Operating Temperature
0°C~90°C TC
Packaging
Tray
Series
TMS320C3x
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Not For New Designs
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
144
Termination
SMD/SMT
ECCN Code
3A001.A.3
Type
Floating Point
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Additional Feature
ALSO OPERATES AT 3.3V SUPPLY
Subcategory
Digital Signal Processors
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.8V
Terminal Pitch
0.5mm
Frequency
60MHz
Base Part Number
320VC33
Pin Count
144
Operating Supply Voltage
3.3V
Interface
Serial Port
Max Supply Voltage
3.6V
Min Supply Voltage
1.71V
Number of I/O
42
RAM Size
136kB
Memory Type
SRAM
Number of Bits
32
Supply Current-Max
80mA
Bit Size
32
Data Bus Width
32b
Core Architecture
TMS320
Boundary Scan
YES
Low Power Mode
YES
Integrated Cache
YES
RAM (words)
34816
Voltage - I/O
3.30V
Number of Timers
2
Number of External Interrupts
4
Barrel Shifter
YES
Internal Bus Architecture
MULTIPLE
Non-Volatile Memory
External
Voltage - Core
1.80V
On Chip Data RAM
136.25kB
Number of DMA Channels
1
Height
1.6mm
Length
20mm
Width
20mm
Thickness
1.4mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
TMS320VC33PGE120 Overview
An electronic component available in package 144-LQFP.It is provided with a packaging way of Tray.Floating Point's wide range of applications makes it ideal for a wide variety of applications.Surface Mount is the direction in which it is mounted.It is essential that 0°C~90°C TC is kept at a temperature that ensures proper operation of the machine.The analog voltage range of 3.30V refers to the input or output voltage.TMS320C3x series digital signal processors contain this digital signal processor.There are 144 terminations for its uses.Using 1.8V as the supply voltage, it operates.Pins are available on the 144 component.This configuration contains 144 pins.Several related parts can be identified using its base part number, 320VC33.Specifically, the device is designed to operate at a frequency of 60MHz.As a mounting method, it uses Surface Mount.The device can be classified as part of the Digital Signal Processors subcategory based on its specific characteristics.The minimum voltage supplied to this device is as low as 1.71V.3.6V is the maximum voltage that can be supplied to this device.3.3V is the supply voltage for this device.It can also provide more features of ALSO OPERATES AT 3.3V SUPPLY.TMS320-architecture is used in this processor core.There are 42 inputs and outputs on the device.SRAM is its memory type.Industrial environments use 2 timers to provide accurate feedback and event activation.Interrupts caused by an external source cause 4 interrupts.The device stores 32 pieces of information.Data is transferred using 1 DMA channels without overloading the CPU.
TMS320VC33PGE120 Features
Supplied in the 144-LQFP package
Operating supply voltage of 3.3V
42 I/Os
4 external interrupts
TMS320VC33PGE120 Applications
There are a lot of Texas Instruments TMS320VC33PGE120 DSP applications.
- MP3 audio player
- Image compression
- Speech processing
- Dam design
- Digital hardware
- Sonar
- Tomography technology
- Streaming music
- Geoscience signal processing
- Statistical signal processing
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthInterfaceMemory TypeRAM SizeMin Supply VoltageSupply VoltageView Compare
TMS320VC33PGE120
NA144-LQFP
144
32 b
Serial Port
SRAM
136 kB
1.71 V
1.8 V
- SM320VC33PGEA120EPNA
144-LQFP
144
32 b
Serial Port
-
136 kB
1.71 V
1.8 V
TMS320VC33PGE120
VS
SM320VC33PGEA120EP
- ADSP-21261SKSTZ150Analog Devices Inc.
144-LQFP
144
32 b
DAI, SPI
ROM
128 kB
1.14 V
1.2 V
TMS320VC33PGE120
VS
ADSP-21261SKSTZ150
ADSP-21489KSWZ-4BAnalog Devices Inc.176-LQFP Exposed Pad
176
32 b
EBI/EMI, DAI, I2C, SPI, SPORT, UART/USART
ROMless
640 kB
1.05 V
1.1 V
TMS320VC33PGE120
VS
ADSP-21489KSWZ-4B
- ADSP-21488BSWZ-4BAnalog Devices Inc.
176-LQFP Exposed Pad
176
32 b
EBI/EMI, DAI, I2C, SPI, SPORT, UART/USART
-
384 kB
1.05 V
1.1 V
TMS320VC33PGE120
VS
ADSP-21488BSWZ-4B
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
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2.Are the Texas Instruments Incorporated (TI)'s TMS320VC33PGE120 price and stock displayed on the website accurate?
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You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
