Texas Instruments SN74V235-15PAG
SN74V235-15PAG
Texas Instruments SN74V235-15PAG information
Type
Parameter
Factory Lead Time
16 Weeks
Lifecycle Status
ACTIVE (Last Updated: 6 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-TQFP
Number of Pins
64
Weight
274.706879mg
Operating Temperature
0°C~70°C
Packaging
Tray
Series
74V
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
Termination
SMD/SMT
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
FIFOs
Technology
CMOS
Voltage - Supply
3V~3.6V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Frequency
66.7MHz
Base Part Number
74V235
Function
Synchronous
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Number of Circuits
2
Memory Size
36K 2K x 18
Element Configuration
Dual
Nominal Supply Current
35mA
Max Supply Current
35mA
Access Time
10ns
Data Bus Width
18b
Direction
Unidirectional
Output Characteristics
3-STATE
Density
36 kb
Parallel/Serial
PARALLEL
Word Size
18b
Memory IC Type
OTHER FIFO
Bus Directional
Uni-Directional
Retransmit Capability
No
Programmable Flags Support
Yes
Output Enable
YES
Expansion Type
Depth, Width
Cycle Time
15 ns
Height
1.2mm
Length
10mm
Width
10mm
Thickness
1mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
SN74V235-15PAG Overview
FIFO memory chip is contained in the 64-TQFP package.In the shape of a Tray , it's packaged.In addition to storing applications and data, the FIFO chips have a memory of 36K 2K x 18 .The temperature should be adjusted to 0°C~70°C in order to ensure reliable operation.Mounting type Surface Mount is assigned to the FIFO memory.Operating voltage is 3V~3.6V .The 74V series is represented by this memory logic.Mounting it Surface Mount is recommended.Memory IC belongs to the 74V235 family.It is possible to achieve high efficiency with a supply voltage of 3.3V .As a result of this, FIFO means contains 64 terminations.The operation pins are 64 pins.In order to operate FIFO design, a maximum current of 35mA is required.For FIFO's maximum efficiency, the supply voltage should be set to 3.3V .There is a self-contained gadget within FIFOs .In this part, the memory type is OTHER FIFO .When the frequency is set to 66.7MHz , the system can maintain good accuracy.Vsup is set to 3.6V (FIFO memory IC's maximum supply voltage).Ideally, the supply voltage (Vsup) should stay above 3V .Through the use of 2 circuits, FIFO memory chip is able to achieve enhanced flexibility.
SN74V235-15PAG Features
36K 2K x 18 memory size
74V series
Best part number of 74V235
FIFOs category
SN74V235-15PAG Applications
There are a lot of Texas Instruments SN74V235-15PAG FIFOs Memory applications.
- Optical memories
- Computer Systems
- Thermal Management for DDR3 Memory Modules
- GPS Offender Tracking
- Temporary storage elements
- Video
- IP Camera Buffer
- Seismic Data Collection at Extreme Temperatures
- Game Controller
- Extended product life cycle
- ImagePart NumberManufacturerPackage / CaseNumber of PinsMemory SizeAccess TimeFrequencyBus DirectionalProgrammable Flags SupportRetransmit CapabilityView Compare
SN74V235-15PAG
NA64-TQFP
64
36K (2K x 18)
10ns
66.7 MHz
Uni-Directional
Yes
No
- SN74V245-15PAGNA
64-TQFP
64
72K (4K x 18)
10ns
66.7 MHz
Uni-Directional
Yes
No
SN74V235-15PAG
VS
SN74V245-15PAG
- SN74V245-20PAGNA
64-TQFP
64
72K (4K x 18)
12ns
50 MHz
Uni-Directional
Yes
No
SN74V235-15PAG
VS
SN74V245-20PAG
- SN74V215-20PAGNA
64-TQFP
64
9K (512 x 18)
12ns
50 MHz
Uni-Directional
Yes
No
SN74V235-15PAG
VS
SN74V215-20PAG
72V205L15PFGIIntegrated Device Technology (IDT)TQFP
64
-
10 ns
66.7 MHz
Unidirectional
-
No
SN74V235-15PAG
VS
72V205L15PFGI
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s SN74V235-15PAG price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
