Texas Instruments MSP430F5507IRGZR
MSP430F5507IRGZR
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Texas Instruments MSP430F5507IRGZR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 5 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Number of Pins
48
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Series
MSP430F5xx
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
48
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
Microcontrollers
Technology
CMOS
Terminal Position
QUAD
Peak Reflow Temperature (Cel)
260
Supply Voltage
3V
Terminal Pitch
0.5mm
Frequency
25MHz
Base Part Number
MSP430
Pin Count
48
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
2/3.3V
Supply Voltage-Min (Vsup)
2.4V
Interface
I2C, IrDA, LIN, SCI, SPI, UART, USART, USB
Memory Size
32kB
Oscillator Type
Internal
Number of I/O
31
RAM Size
6K x 8
Voltage - Supply (Vcc/Vdd)
1.8V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor
CPUXV2
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
16-Bit
Program Memory Size
32KB 32K x 8
Connectivity
I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Supply Current-Max
7mA
Bit Size
16
Data Converter
A/D 8x10b
Watchdog Timer
Yes
Has ADC
YES
DMA Channels
YES
Data Bus Width
16b
PWM Channels
YES
DAC Channels
NO
Number of Timers/Counters
18
Boundary Scan
YES
Low Power Mode
YES
Number of A/D Converters
8
Format
FIXED-POINT
Integrated Cache
NO
RAM (words)
4
Number of UART Channels
1
Number of Serial I/Os
4
Number of GPIO
47
Height
1mm
Length
7mm
Width
7mm
Thickness
900μm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- PCN Other :
- Datasheets :
MSP430F5507IRGZR Overview
The package is in 48-VFQFN Exposed Pad format. There are 31 I/O ports on this device. It is important to note that the Microcontroller has a Surface Mount mounting type. This Microcontroller is based on the 16-Bit core. The type of program memory it uses is FLASH. Temperatures within -40°C~85°C TA range are measured by this Microcontroller. An electrical component of this type belongs to the MSP430F5xx series. Its program memory size is 32KB 32K x 8. A CPUXV2 Core Processor is at the core of this Microcontroller. This is a MICROCONTROLLER, RISC uPs/uCs/Peripheral IC. This chip has a total of 48 terminations on MCU chip. A 16-bit operation is performed by this part. The component always operates in 3V supply voltage. There are YES DMA channels on this Microcontroller chip. Its memory size is 32kB. Alternatives can be found by searching through the base part number MSP430 to find them. This device is extremely efficient when operated at a frequency of 25MHz. It is possible for the device to work with the motor using the PWM channel YES. It is possible to access the 48 pins on the chip through the 48 pins. The clock has 18 timers or counters on it. It has 48 pins in total. The device features 8 UART channels. This device comes with a set of 8 A/D converters that have been built into it. It contains 4 serial input/output interfaces on the board.
MSP430F5507IRGZR Features
48-VFQFN Exposed Pad package
Mounting type of Surface Mount
Microcontrollers subcategory
MSP430F5507IRGZR Applications
There are a lot of Texas Instruments MSP430F5507IRGZR Microcontroller applications.
- Fabric
- Accu-check
- Oscilloscopes
- CD players
- Entertainment products
- Fax machines
- Automatic staplers
- Fire alarms
- Answering machines
- Fax machines
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsView Compare
MSP430F5507IRGZR
NA48-VFQFN Exposed Pad
48
16 b
31
I2C, IrDA, LIN, SCI, SPI, UART, USART, USB
32 kB
3 V
Brown-out Detect/Reset, DMA, POR, PWM, WDT
- MSP430F5309IRGZRNA
48-VFQFN Exposed Pad
48
16 b
31
I2C, IrDA, LIN, SCI, SPI, UART, USART
24 kB
3 V
Brown-out Detect/Reset, DMA, POR, PWM, WDT
MSP430F5507IRGZR
VS
MSP430F5309IRGZR
- MSP430F5310IRGZRNA
48-VFQFN Exposed Pad
48
16 b
31
I2C, IrDA, LIN, SCI, SPI, UART, USART
32 kB
3 V
Brown-out Detect/Reset, DMA, POR, PWM, WDT
MSP430F5507IRGZR
VS
MSP430F5310IRGZR
- MSP430F5310IRGZTNA
48-VFQFN Exposed Pad
48
16 b
31
I2C, IrDA, LIN, SCI, SPI, UART, USART
32 kB
3 V
Brown-out Detect/Reset, DMA, POR, PWM, WDT
MSP430F5507IRGZR
VS
MSP430F5310IRGZT
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
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2.Are the Texas Instruments Incorporated (TI)'s MSP430F5507IRGZR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
