Texas Instruments FDC1004DSCT
FDC1004DSCT
In Stock:94131
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Texas Instruments FDC1004DSCT information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 1 day ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
10-WFDFN Exposed Pad
Number of Pins
10
Operating Temperature
-40°C~125°C
Packaging
Tape & Reel (TR)
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
10
ECCN Code
EAR99
Type
Proximity Only
Terminal Finish
Matte Tin (Sn)
Voltage - Supply
3V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Base Part Number
FDC1004
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Number of Channels
4
Interface
I2C
Operating Supply Current
750μA
Number of Inputs
4
Resolution
16 b
Proximity Detection
Yes
Total Dose
9-Sep-19 V
Height
800μm
Length
3mm
Width
3mm
Thickness
750μm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- PCN Assembly/Origin :
- Datasheets :
FDC1004DSCT Overview
In order to package it, Tape & Reel (TR) materials are used. Surface Mount is used for mounting it on the PCB. A significant reason for 10-WFDFN Exposed Pad's popularity in the electronic industry is its low package cost. The 3V~3.6V Supply Voltage ensures that it operates normally. The inputs of 4 are used. As a standard grade, it falls into Type Proximity Only. You should always keep its operating temperature at -40°C~125°C. 16 b is the resolution of the part. 750μA is the supply current of the device. The structure is constructed by using terminations of 10. Despite this, the pin number of the component remains 10. FDC1004 represents the most important part of the gadget. 3.3V-volts supply power to the component. There must be more voltage present in the supply, Vsup, than volts consumed, 3V. At Vsup, maximum Supply Voltage (3.6V) is reached. In the reflow process, the peak temperature is 260. As part of the Surface Mount mount, it is included. In this case, there are no channels for transmitting data.
FDC1004DSCT Features
10-WFDFN Exposed Pad package
FDC1004DSCT Applications
There are a lot of Texas Instruments FDC1004DSCT Capacitive Sensors applications.
- Kiosks and POS terminals
- Material Size Detection
- Tablets
- Level Sensor for Liquids, including Conductive ones such as Detergent, Soap, and Ink
- Appliances
- MP3 Players
- Automotive Door and Kick Sensors
- PC peripherals
- Set-top boxes, multi-function printers,enterprise telephony
- Compact Capacitive Keyboards
- ImagePart NumberManufacturerPackage / CaseNumber of InputsNumber of PinsInterfaceSupply VoltageRoHS StatusECCN CodeREACH SVHCView Compare
FDC1004DSCT
NA10-WFDFN Exposed Pad
4
10
I2C
3.3 V
ROHS3 Compliant
EAR99
No SVHC
AD7151BRMZAnalog Devices Inc.10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
-
10
2-Wire, I2C
-
ROHS3 Compliant
EAR99
No SVHC
FDC1004DSCT
VS
AD7151BRMZ
MCP9843-BE/STMicrochip Technology8-TSSOP (0.173, 4.40mm Width)
-
8
2-Wire, I2C, SMBus, Serial
-
ROHS3 Compliant
EAR99
No SVHC
FDC1004DSCT
VS
MCP9843-BE/ST
- AD7150BRMZAnalog Devices Inc.
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
-
10
2-Wire, I2C
-
ROHS3 Compliant
EAR99
No SVHC
FDC1004DSCT
VS
AD7150BRMZ
- AD7152BRMZAnalog Devices Inc.
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
-
10
2-Wire, I2C
3.3 V
ROHS3 Compliant
EAR99
No SVHC
FDC1004DSCT
VS
AD7152BRMZ
Aztec Electronics's Payment Terms
Aztec Electronics offers many types of payment options, and support in multiple currencies such as GBP, US dollars, RMB, etc. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s FDC1004DSCT price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
