STMicroelectronics LIS3DHTR
LIS3DHTR
In Stock:94131
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STMicroelectronics LIS3DHTR information
Type
Parameter
Factory Lead Time
16 Weeks
Lifecycle Status
ACTIVE (Last Updated: 7 months ago)
Contact Plating
Gold
Mounting Type
Surface Mount
Package / Case
16-VFLGA
Surface Mount
YES
Number of Pins
16
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
JESD-609 Code
e4
Feature
Adjustable Bandwidth, Selectable Scale, Temperature Sensor
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
16
ECCN Code
EAR99
Type
Digital
HTS Code
8542.39.00.01
Subcategory
Other Analog ICs
Voltage - Supply
1.71V~3.6V
Terminal Position
BOTTOM
Terminal Form
BUTT
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
2.5V
Terminal Pitch
0.5mm
Depth
3mm
Reflow Temperature-Max (s)
30
Base Part Number
LIS3
Pin Count
16
Output Type
I2C, SPI
Operating Supply Voltage
2.5V
Interface
I2C, SPI
Operating Supply Current
11μA
Bandwidth
0.5Hz ~ 625Hz
Resolution
2 B
Sensor Type
3 Axis
Max Supply Voltage (DC)
3.6V
Min Supply Voltage (DC)
1.71V
Axis
X, Y, Z
Acceleration Range
±2g, 4g, 8g, 16g
Sensitivity (LSB/g)
1000 (±2g) ~ 83 (±16g)
Height
1mm
Length
3mm
Width
3mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
LIS3DHTR Description
The LIS3DHTR is a digital I2C/SPI serial interface standard output, three-axis, ultra-low-power, high-performance accelerometer from the "nano" family. The system has ultra-low power operating modes that enable sophisticated power management and intelligent embedded functionalities.
The LIS3DHTR is capable of measuring accelerations with output data rates from 1 Hz to 5.3 kHz and has dynamically user-selectable complete scales of ±2g, ±4g, ±8g, and ±16g. The user can test the sensor's performance in the intended application thanks to the self-test feature. Two independent inertial wake-up/free-fall occurrences and the device's position can both be used to configure the device to produce interrupt signals.
End users can dynamically program interrupt generator thresholds and timing. The embedded 32-level first-in, first-out (FIFO) buffer on the LIS3DHTR enables users to store data and limit host processor involvement. The LIS3DHTR can work across a wide temperature range, from -40 °C to +85 °C, and is offered in a tiny thin plastic land grid array package (LGA).
LIS3DHTR Features
2 independent programmable interrupt generators for free-fall and motion detection
6D/4D orientation detection
Free-fall detection
Motion detection
Embedded temperature sensor
Embedded self-test
Embedded 32 levels of 16-bit data output FIFO
10000 g high shock survivability
ECOPACK®, RoHS and “Green” compliant
Wide supply voltage, 1.71 V to 3.6 V
Independent IO supply (1.8 V) and supply voltage compatible
Ultra-low-power mode consumption down to 2 μA
±2g/±4g/±8g/±16g dynamically selectable full scale
I2C/SPI digital output interface
16-bit data output
LIS3DHTR Applications
Display orientation
Gaming and virtual reality input devices
Impact recognition and logging
Vibration monitoring and compensation
Motion activated functions
Free-fall detection
Click/double-click recognition
Intelligent power saving for handheld devices
Pedometers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsMin Supply Voltage (DC)Supply VoltageMax Supply Voltage (DC)Operating TemperatureMoisture Sensitivity Level (MSL)RoHS StatusView Compare
LIS3DHTR
STMicroelectronics16-VFLGA
16
1.71 V
2.5 V
3.6 V
-40°C ~ 85°C (TA)
3 (168 Hours)
ROHS3 Compliant
MMA6331LR1NXP USA Inc.14-TFLGA
-
-
-
-
-40°C ~ 85°C (TA)
3 (168 Hours)
ROHS3 Compliant
LIS3DHTR
VS
MMA6331LR1
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2.Are the STMicroelectronics's LIS3DHTR price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
