NXP USA Inc. MKL25Z128VLH4
MKL25Z128VLH4
NXP USA Inc. MKL25Z128VLH4 information
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
64-LQFP
Surface Mount
YES
Operating Temperature
-40°C~105°C TA
Packaging
Tray
Published
2002
Series
Kinetis KL2
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.A.2
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.31.00.01
Subcategory
Microcontrollers
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Reflow Temperature-Max (s)
40
Base Part Number
MKL25Z128
JESD-30 Code
S-PQFP-G64
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.3V
Supply Voltage-Min (Vsup)
1.71V
Oscillator Type
Internal
Number of I/O
50
Speed
48MHz
RAM Size
16K x 8
Voltage - Supply (Vcc/Vdd)
1.71V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor
ARM® Cortex®-M0+
Peripherals
Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Clock Frequency
48MHz
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
128KB 128K x 8
Connectivity
I2C, LINbus, SPI, UART/USART, USB, USB OTG
Supply Current-Max
7.8mA
Bit Size
32
Data Converter
A/D 14x16b; D/A 1x12b
Has ADC
YES
DMA Channels
YES
PWM Channels
YES
DAC Channels
YES
ROM (words)
131072
CPU Family
CORTEX-M0
Length
10mm
Width
10mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Assembly/Origin :
- PCN Packaging :
MKL25Z128VLH4 Description
Efficiency is taken into account in the design. Compatible with all other Kinetis L series as well as Kinetis K2x series. General MCU, which supports USB 2.0, has a market-leading ultra-low power consumption and provides developers with an appropriate entry-level 32-bit solution. This product provides: operating power as low as 47 μ A / Mhz in very low power operation mode, static power consumption as low as 2 μ A, full-state hold and 4 μ s wake up ultra-efficient Cortex-M0+ processors running up to 48 MHz, industry-leading throughput memory options up to 128 KB flash memory and 16 KB RAM energy-saving architecture optimized with 90 nm TFS technology, clock and power gating technology, and zero-wait-state flash controller. To achieve low power consumption
MKL25Z128VLH4 Features
Performance
? 48 MHz ARM? Cortex?-M0+ core
Memories and memory interfaces
? Up to 128 KB program flash memory
? Up to 16 KB SRAM
System peripherals
? Nine low-power modes to provide power optimization
based on application requirements
? COP Software watchdog
? 4-channel DMA controller, supporting up to 63 request
sources
? Low-leakage wakeup unit
? SWD debug interface and Micro Trace Buffer
? Bit Manipulation Engine
Clocks
? 32 kHz to 40 kHz or 3 MHz to 32 MHz crystal oscillator
? Multi-purpose clock source
? 1 kHz LPO clock
Operating Characteristics
? Voltage range: 1.71 to 3.6 V
MKL25Z128VLH4 Applications
Run Mode
Active Background Mode
- ImagePart NumberManufacturerPackage / CaseNumber of I/OSupply VoltagePeripheralsTerminal PitchSupply Voltage-Max (Vsup)Program Memory SizeCPU FamilyView Compare
MKL25Z128VLH4
NXP USA Inc.64-LQFP
50
3.3 V
Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
0.5 mm
3.6 V
128KB (128K x 8)
CORTEX-M0
STM32F072RBT6STMicroelectronics64-LQFP
51
3.3 V
DMA, I2S, POR, PWM, WDT
0.5 mm
3.6 V
128KB (128K x 8)
CORTEX-M0
MKL25Z128VLH4
VS
STM32F072RBT6
- MKL36Z128VLH4NXP USA Inc.
64-LQFP
50
3.3 V
Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
0.5 mm
3.6 V
128KB (128K x 8)
CORTEX-M0
MKL25Z128VLH4
VS
MKL36Z128VLH4
- MKL26Z128VLH4NXP USA Inc.
64-LQFP
50
3.3 V
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
0.5 mm
3.6 V
128KB (128K x 8)
CORTEX-M0
MKL25Z128VLH4
VS
MKL26Z128VLH4
- MKL46Z128VLH4NXP USA Inc.
64-LQFP
50
1.8 V
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
0.5 mm
3.6 V
128KB (128K x 8)
CORTEX-M0
MKL25Z128VLH4
VS
MKL46Z128VLH4
Aztec Electronics's Payment Terms
Aztec Electronics offers many types of payment options, and support in multiple currencies such as GBP, US dollars, RMB, etc. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Freescale Semiconductor, Inc. (NXP Semiconductors)'s MKL25Z128VLH4 price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Freescale Semiconductor's current name is NXP Semiconductor. In terms of embedded processing solutions, Freescale Semiconductor is a global leader. We realize everything from microprocessors and microcontrollers to sensors, analog integrated circuits and connections. We firmly believe that technology is the foundation of innovation. Innovation can make our world greener, safer, healthier and more connected. Our key applications and end markets are numerous. There are not only automotive safety, hybrid and all-electric vehicles, next-generation wireless infrastructure, smart energy management, smart mobile devices, but also portable medical devices and consumer appliances.
