Microchip Technology ATSAMD20G18A-MNT
ATSAMD20G18A-MNT
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Microchip Technology ATSAMD20G18A-MNT information
Type
Parameter
Factory Lead Time
7 Weeks
Contact Plating
Tin
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Surface Mount
YES
Number of Pins
48
Operating Temperature
-40°C~105°C TA
Packaging
Tape & Reel (TR)
Published
2015
Series
SAM D20G
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
48
Technology
CMOS
Terminal Position
QUAD
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Frequency
48MHz
Reflow Temperature-Max (s)
30
Base Part Number
ATSAMD20G18
Interface
I2C, SPI, UART, USART
Memory Size
256kB
Oscillator Type
Internal
Number of I/O
38
RAM Size
32K x 8
Voltage - Supply (Vcc/Vdd)
1.62V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor
ARM® Cortex®-M0+
Peripherals
Brown-out Detect/Reset, POR, WDT
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
256KB 256K x 8
Connectivity
I2C, SPI, UART/USART
Bit Size
32
Data Converter
A/D 14x12b; D/A 1x10b
Watchdog Timer
Yes
Has ADC
YES
DMA Channels
NO
PWM Channels
YES
DAC Channels
YES
Number of Timers/Counters
6
Density
2 Mb
Core Architecture
ARM
Number of Programmable I/O
38
Height Seated (Max)
0.9mm
Length
7mm
Width
7mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- PCN Design/Specification :
microchiptechnology-ata8204p3ctkqw-pcndesignspecification-9786.pdf
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
ATSAMD20G18A-MNT Overview
The package has a 48-VFQFN Exposed Pad shape. The MCU has 38 I/O ports. In the case of the IC chip, the type of mounting is Surface Mount. There is a 32-Bit core at the core of this MCU. As far as its program memory type is concerned, it is FLASH. The temperature range that this Microcontroller operates at is -40°C~105°C TA. SAM D20G series components make up this electrical component. This program has a program memory of 256KB 256K x 8 bytes, which is the size of the program. The ARM® Cortex®-M0+ Core Processor powers the device and is one of its key features. ICs for MICROCONTROLLER, RISC uPs/uCs/peripheral parts. There are 48 terminations on the IC chip. 32-bits are used in Microcontroller. Input voltage for the chip is 3.3V volts. The Microcontroller chip has NO DMA channels. 256kB is the memory size of the part. It is possible to find alternatives to the base part number ATSAMD20G18 by using the part number search tool. This device is extremely efficient when operated at a frequency of 48MHz. Using the PWM channel YES, the device works with the motor. The pin number of the component remains 48. The clock has 6 timers or counters on it. There is a ARM core architecture integrated into it. There are 38 Programmable I/Os on this computer.
ATSAMD20G18A-MNT Features
48-VFQFN Exposed Pad package
Mounting type of Surface Mount
ATSAMD20G18A-MNT Applications
There are a lot of Microchip Technology ATSAMD20G18A-MNT Microcontroller applications.
- Smart instruments
- Christmas lights
- Binding machines
- Electronic jamming systems
- PDAs, game consoles
- DVDDVMP3 players
- Broadband technology
- Accu-check
- Wastewater treatment
- Industrial instrumentation devices
- ImagePart NumberManufacturerPackage / CaseNumber of PinsCore ArchitectureNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsView Compare
ATSAMD20G18A-MNT
Microchip Technology48-VFQFN Exposed Pad
48
ARM
38
I2C, SPI, UART, USART
256 kB
3.3 V
Brown-out Detect/Reset, POR, WDT
- ATSAMD21G18A-MUMicrochip Technology
48-VFQFN Exposed Pad
48
ARM
38
I2C, I2S, LIN, SPI, UART, USART, USB
256 kB
3.3 V
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
ATSAMD20G18A-MNT
VS
ATSAMD21G18A-MU
- ATSAMD21G18A-MFMicrochip Technology
48-VFQFN Exposed Pad
48
ARM
38
I2C, I2S, LIN, SPI, UART, USART, USB
256 kB
3.3 V
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
ATSAMD20G18A-MNT
VS
ATSAMD21G18A-MF
MKL16Z32VFT4NXP USA Inc.48-VFQFN Exposed Pad
-
-
40
-
-
3.3 V
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
ATSAMD20G18A-MNT
VS
MKL16Z32VFT4
- ATSAMD21G16B-MUMicrochip Technology
48-VFQFN Exposed Pad
48
ARM
38
I2C, I2S, LIN, SPI, UART, USART, USB
64 kB
3.3 V
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
ATSAMD20G18A-MNT
VS
ATSAMD21G16B-MU
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You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
