Microchip Technology ATSAMC21G18A-MUT
ATSAMC21G18A-MUT
Microchip Technology ATSAMC21G18A-MUT information
Type
Parameter
Factory Lead Time
26 Weeks
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Surface Mount
YES
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2016
Series
SAM C21
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
48
Terminal Finish
Matte Tin (Sn)
Technology
CMOS
Terminal Position
QUAD
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
5V
Terminal Pitch
0.5mm
Frequency
48MHz
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
ATSAMC21
JESD-30 Code
S-XQCC-N48
Supply Voltage-Max (Vsup)
5.5V
Supply Voltage-Min (Vsup)
2.7V
Interface
CAN, I2C, LIN, SPI, UART, USART
Memory Size
256kB
Oscillator Type
Internal
Number of I/O
38
RAM Size
32K x 8
Voltage - Supply (Vcc/Vdd)
2.7V~5.5V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor
ARM® Cortex®-M0+
Peripherals
Brown-out Detect/Reset, DMA, POR, WDT
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
256KB 256K x 8
Connectivity
CANbus, I2C, LINbus, SPI, UART/USART
Bit Size
32
Data Converter
A/D 14x12b, 2x16b; D/A 1x10b
Has ADC
YES
DMA Channels
YES
PWM Channels
YES
DAC Channels
YES
Core Architecture
ARM
On Chip Program ROM Width
8
Screening Level
TS 16949
Height Seated (Max)
0.9mm
Length
7mm
Width
7mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
ATSAMC21G18A-MUT Overview
There is a 48-VFQFN Exposed Pad package available. The MCU has 38 I/O ports. The Microcontroller has a mounting type of Surface Mount, which indicates that it is mounted conveniently. Powered by the 32-Bit core, it offers a wide range of capabilities. This program has a type of memory called FLASH for this MCU's program memory. In this Microcontroller, temperature is controlled within the range -40°C~85°C TA. A SAM C21 series electrical component is used in this application. This program has a program memory of 256KB 256K x 8 bytes, which is the size of the program. The ARM® Cortex®-M0+ Core Processor powers the device and is one of its key features. This device belongs to the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. Microcontroller is known that the chip has 48 terminations in total. 32-bits are the size of the data that comes with MCU. A 5V volt supply is provided by the Microcontroller chip. MCU chip has YES DMA channels. The part owns 256kB memory size. Using the base part number ATSAMC21, you will be able to find alternatives for the part. A good performance can be achieved at a frequency of 48MHz, as long as it is operated at a low power consumption. Using YES PWM channels, the device works. This device features a ARM core architecture.
ATSAMC21G18A-MUT Features
48-VFQFN Exposed Pad package
Mounting type of Surface Mount
ATSAMC21G18A-MUT Applications
There are a lot of Microchip Technology ATSAMC21G18A-MUT Microcontroller applications.
- Copiers
- Refrigerators
- Removable disks
- ECG machine
- Light sensing & controlling devices
- Leakage current tester
- PDAs, game consoles
- Video and voice processing
- Data acquisition and control
- Electromechanical control
- ImagePart NumberManufacturerPackage / CaseCore ArchitectureNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsMoisture Sensitivity Level (MSL)View Compare
ATSAMC21G18A-MUT
Microchip Technology48-VFQFN Exposed Pad
ARM
38
CAN, I2C, LIN, SPI, UART, USART
256 kB
5 V
Brown-out Detect/Reset, DMA, POR, WDT
3 (168 Hours)
MSP430F249TRGCTNA64-VFQFN Exposed Pad
ARM
48
I2C, IrDA, LIN, SCI, SPI, UART, USART
60 kB
3 V
Brown-out Detect/Reset, POR, PWM, WDT
3 (168 Hours)
ATSAMC21G18A-MUT
VS
MSP430F249TRGCT
XMC1404Q048X0200AAXUMA1Infineon Technologies48-VFQFN Exposed Pad
ARM
34
CAN, I2C, LIN, SPI, UART, USART
200 kB
3.3 V
Brown-out Detect/Reset, I2S, LED, POR, PWM, WDT
3 (168 Hours)
ATSAMC21G18A-MUT
VS
XMC1404Q048X0200AAXUMA1
- XMC1403Q048X0200AAXUMA1Infineon Technologies
48-VFQFN Exposed Pad
ARM
34
CAN, I2C, LIN, SPI, UART, USART
200 kB
3.3 V
Brown-out Detect/Reset, I2S, POR, PWM, WDT
3 (168 Hours)
ATSAMC21G18A-MUT
VS
XMC1403Q048X0200AAXUMA1
XMC1302Q040X0200ABXUMA1Infineon Technologies40-VFQFN Exposed Pad
ARM
27
I2C, I2S, LIN, SPI, UART, USART
200 kB
-
Brown-out Detect/Reset, I2S, POR, PWM, WDT
3 (168 Hours)
ATSAMC21G18A-MUT
VS
XMC1302Q040X0200ABXUMA1
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
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