Infineon Technologies IRS21834STRPBF
IRS21834STRPBF
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Infineon Technologies IRS21834STRPBF information
Type
Parameter
Factory Lead Time
26 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
14-SOIC (0.154, 3.90mm Width)
Number of Pins
14
Operating Temperature
-40°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
1996
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
2 (1 Year)
Number of Terminations
14
ECCN Code
EAR99
Terminal Finish
Tin (Sn)
Subcategory
MOSFET Drivers
Max Power Dissipation
1W
Technology
CMOS
Voltage - Supply
10V~20V
Terminal Position
DUAL
Terminal Form
GULL WING
Number of Functions
1
Supply Voltage
15V
Base Part Number
IRS21834SPBF
Output Voltage
10V
Max Output Current
2.3A
Power Supplies
15V
Nominal Supply Current
1.6mA
Power Dissipation
1W
Output Current
1.9A
Max Supply Current
1.6mA
Propagation Delay
330 ns
Input Type
Inverting, Non-Inverting
Turn On Delay Time
180 ns
Rise Time
60ns
Fall Time (Typ)
35 ns
Turn-Off Delay Time
220 ns
Rise / Fall Time (Typ)
40ns 20ns
Channel Type
Independent
Number of Drivers
2
Output Peak Current Limit-Nom
1.9A
Driven Configuration
Half-Bridge
Gate Type
IGBT, N-Channel MOSFET
Current - Peak Output (Source, Sink)
1.9A 2.3A
Logic Voltage - VIL, VIH
0.8V 2.5V
Turn Off Time
0.33 μs
Built-in Protections
TRANSIENT; UNDER VOLTAGE
High Side Voltage - Max (Bootstrap)
600V
Height
1.4986mm
Length
8.7376mm
Width
3.9878mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Other Related Documents :
- PCN Packaging :
- ConflictMineralStatement :
IRS21834STRPBF Overview
There is greater flexibility with the 14-SOIC (0.154, 3.90mm Width) package.Tape & Reel (TR) is the packaging method.This device is equipped with 2 drivers for its configuration.There is a mounting bracket in the way of Surface Mount.Gate drivers can demonstrate Gate driverss superiorGate driversy wGate driversh a 10V~20V supply voltage.Gate type IGBT, N-Channel MOSFET has been used in its design.This device is allowed to operate in a temperature range of -40°C~150°C TJ.This program uses the input type of Inverting, Non-Inverting.Mosfet driver is based on 14 terminations.There are various related parts under its base part number IRS21834SPBF.The device is mounted using Surface Mount.During design, it is configured with 14 pins.In addition, it is specifically designed to operate with a supply voltage of 15V.There is a maximum output current of 2.3A that can be achieved.The subcategory of MOSFET Drivers contains a wide variety of useful electronic components.Mosfet driver is possible for the high-side voltage - Max (Bootstrap) to be as low as 600V.The output current can be set to 1.9A.Considering its maximum power dissipation, 1W shows its maximum capacity to transfer and conduct power loss without overheating.As a precaution, make sure the supply current is kept at 1.6mA.Due to its 15V power supply, it can solve power supply problems for an array of diverse applications.A voltage of 10V is output by this device.
IRS21834STRPBF Features
Embedded in the Tape & Reel (TR) package
2 drivers
Employing a gate type of IGBT, N-Channel MOSFET
14 pins
High-side voltage - Max (Bootstrap) of 600V
Maximum power dissipation of 1W
IRS21834STRPBF Applications
There are a lot of Infineon Technologies IRS21834STRPBF gate drivers applications.
- Portable Navigation Devices
- Video amplifiers
- High current laser/LED systems
- 48 V to 12 V PoL Converters, 48 V to Low Voltage Bus Converter,
- Portable Media Players
- Commercial air-conditioning (CAC)
- Solar power supplies
- Driving GaN Power Transistors used in Full or Half?Bridge, LLC,
- Isolated Supplies for Motor Control
- Multicolor LED/laser displays
- ImagePart NumberManufacturerPackage / CaseNumber of PinsChannel TypeNumber of DriversMax Output CurrentOutput CurrentRise TimeSupply VoltageMax Power DissipationView Compare
IRS21834STRPBF
Infineon Technologies14-SOIC (0.154, 3.90mm Width)
14
Independent
2
2.3 A
1.9 A
60 ns
15 V
1 W
MIC4424YWMMicrochip Technology16-SOIC (0.295, 7.50mm Width)
16
Independent
2
3 A
3 A
28 ns
-
960 mW
IRS21834STRPBF
VS
MIC4424YWM
- MIC4424ZWM-TRMicrochip Technology
16-SOIC (0.295, 7.50mm Width)
16
Independent
2
3 A
-
35 ns
-
-
IRS21834STRPBF
VS
MIC4424ZWM-TR
AUIRS2110SInfineon Technologies16-SOIC (0.295, 7.50mm Width)
16
Independent
2
2.5 A
2.5 A
40 ns
15 V
1.25 W
IRS21834STRPBF
VS
AUIRS2110S
- IRS21856SPBFInfineon Technologies
14-SOIC (0.154, 3.90mm Width)
14
Independent
2
500 mA
500 mA
30 ns
-
1 W
IRS21834STRPBF
VS
IRS21856SPBF
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
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Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Infineon Technologies's IRS21834STRPBF price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
